Filament Spectrum HIPS-X White

High impact resistance

Spectrum HIPS-X is a carrier material designed for additive manufacturing for FDM/FFF technology. It is typically used as a support for components made from ABS, where HIPS-X carriers are dissolved with D-Limonene after the manufacturing process is complete. Additionally, Spectrum HIPS-X can be used as a base material for manufacturing components that require less shrinkage during processing compared to ABS.

Spectrum HIPS-X exhibits high impact and compression resistance. It also allows you to obtain matte surfaces with reduced layer visibility. Similar to ABS, HIPS-X allows mechanical treatments such as grinding, turning, milling, etc. The low hardness of the printed items allows easy separation of material parts with sharp tools.

Key features:

Improved aesthetic properties due to the matt surfaces of the printed objects.

lower shrinkage rate than conventional ABS

possibility of mechanical processing (drilling, turning, milling or grinding)

heat resistance - HDT B 88°C

Vicat softening temperature - 96°C

High impact resistance

ability to absorb and dissipate energy

good for large prints

light

fully soluble in D-limonene

matt surface

Application:

Carrier material for ABS

Industrial applications requiring impact resistant components or components with partial energy dissipation capability

concept and demo prototyping of designed finished and semi-finished products

Cover

Spectrum HIPS-X, which is mainly used as a carrier material, is also designed for industrial applications that require impact resistant components or components with partial energy dissipation capability. Due to its low hardness, HIPS-X can be used in the arts, specifically in sculpture.